Fine-Scale Mechanical Properties of Sliding Solids.

Abstract

This report describes fine-scale contact experiments specifically designed to investigate the mechanical properties of materials at the submicroscopic level. The first part deals with experiments carried out using an ultra-high vacuum (UHV) mechanical microprobem in which adhesion and friction are measured between a sharply-pointed metal tip and a flat surface at very light loads. The results show that, for a metal-metal or metal-ceramic interface, the adhesion and frictional resistance to tangential sliding are highest for clean surfaces in UHV. However, for contacts between a metal tip and an amorphous metallic glass both adhesion and friction are lower after standard cleaning procedures in UHV. Part II describes fine-scale indentation measurements on thin films ad ion-implanted surfaces carried out in the laboratory ambient. It is shown that surface layers less than a few hundred nanometres thickness can be successfully characterised in terms of plastic, elastic and time-dependent properties. Keywords: Adhension, Friction, Microhardness, Ultra-high vacuum, Mechanical microprobe, Sub-micron indentation device, Microdeformation, Mechanical characterisation.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1987
Accession Number
ADA182940

Entities

People

  • H. M. Pollock
  • J. D. Ross

Organizations

  • University of Lancaster

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Elastic Properties
  • Friction
  • Geometry
  • Ion Implantation
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Plastic Properties
  • Surface Properties
  • Surface Roughness
  • Thin Films

Fields of Study

  • Engineering
  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.