Bond Character at a Silicon/Copper Surface.

Abstract

The ionic and covalent character of bonding is considered for the Si (111)-(5x5) Cu phase formed when one monolayer of copper is deposited on Si(111)(7x7) and subsequently annealed to 600C. Localized orbitals and ab initio calculations have been employed to evaluate total energies and types of bonding for Cu adsorbed in several different sites, including the structure proposed by Chambers et al (1) on the basis of their angle resolved Auger electron spectroscopy results. The relation between the bond character of this phase and its surface spectroscopic properties is discussed.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1986
Accession Number
ADA184167

Entities

People

  • C. H. Patterson
  • E. W. Plummer
  • Richard P. Messmer

Organizations

  • University of Pennsylvania

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Auger Electron Spectroscopy
  • Auger Electrons
  • Electron Spectroscopy
  • Electrons
  • First Principles Calculations
  • Military Research
  • New York
  • Pennsylvania
  • Personality
  • Semiconductors
  • Spectroscopy
  • United States

Fields of Study

  • Materials science

Readers

  • Quantum Chemistry
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Space