Electromagnetics and Electrothermal Approach to Evaluate Failures in Microelectronic Devices Caused by Electrostatic Discharges: Stochastical Aspects of the Device Reliability.

Abstract

This report summarizes the following research efforts addressed in the project: Interaction of electromagnetic overstresses, such as electrostatic discharge (ESD) with the microelectronic devices, resulting IC damage(s) and methods of preventing the related failures.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1987
Accession Number
ADA184906

Entities

People

  • Perambur S. Neelakantaswamy

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Composite Materials
  • Differential Equations
  • Elastic Properties
  • Electrical Engineering
  • Electromagnetic Fields
  • Electromagnetic Radiation
  • Electronics Industry
  • Electronics Laboratories
  • Failure Mode And Effect Analysis
  • Field Effect Transistors
  • Modules (Electronics)
  • Modulus Of Elasticity
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors
  • Test Methods
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Plasma Physics.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems