Development of Methods for Low Temperature Diffusion Bonding.
Abstract
An apparatus for low temperature diffusion bonding of dissimilar metals has been developed. Experiments varying the bonding temperature at constant pressure and time were conducted utilizing type 316 stainless steel samples coated with a layer of silver in order to verify the design of the apparatus and the bonding procedures. The Scanning Electron Microscope (SEM) was used to illustrate the effects of temperature variation on the microstructure of the bonds produced. The results showed diffusion bonds of silver to silver to be possible at all three temperatures used. Recrystallization and or grain growth in the silver coating occurred at the bond interface at 300 C and the entire coating was beginning to recrystallize and undergo grain growth at 400 C after 30 minutes at 20,000 psi (137.9 MPa). The experiments successfully demonstrated the capability of the apparatus, but much more development of the bonding procedure is required. Keywords: Low temperature, Methods of diffusion, Bonding, Solid, State bonding, or Diffusion welding.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1987
- Accession Number
- ADA186875
Entities
People
- Paul A. Muffler
Organizations
- Naval Postgraduate School