A Viscoelastic BEM (Boundary Element Method) for Modeling Oxidation,

Abstract

A viscoelastic boundary element has been developed to model the motion of silicon dioxide and silicon nitride during thermal oxidation of silicon. This technique uses Kelvin's solution reformulated according to the correspondence principle on viscoelasticity. Constant velocity loading is chosen to ensure smooth variations in displacement and stress behavior for a wide range of relaxation times.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1987
Accession Number
ADA187490

Entities

People

  • Dimitri A Antoniadis
  • Jerome Connor
  • Thye-lai Tung

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Boundaries
  • Boundary Element Methods
  • Ceramic Materials
  • Civil Engineering
  • Elastic Materials
  • Electrical Engineering
  • Elements
  • Engineering
  • Flow
  • Integral Equations
  • Materials
  • Modulus Of Elasticity
  • Oxidation
  • Oxides
  • Relaxation Time
  • Simulations
  • Surface Properties

Readers

  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Integrated Circuit Design and Technology.
  • Petroleum Engineering