Adhesion of Vapour Phase Deposited Ultra-Thin Polyimide Films on Polycrystalline Silver.

Abstract

The vapour phase deposition of 4.4 Oxydianiline (ODA) and Pyromellitic dianhydride (PMDA) on a polycrystalline silver substrate was studied using X-ray photoelectron spectroscopy. Adsorption of the pure components on the clean substrate at room temperature results in partial fragmentation of the adsorbate molecules. Bonding to the silver is believed to occur via the oxygens in the ODA and PMDA fragments. Room temperature codeposition of PMDA and ODA in a thin (-36 A) layer, followed by heating, led to polymerization and the formation of an ultra-thin (-11 A) and thermally stable (T<450 C) polyimide film. Adhesion of this polymer involves chemical bonding to the fragments of PMDA and ODA initially chemisorbed on the surface. These experiments demonstrate that sufficiently thin polymerized films can be prepared and applied to fundamental studies of adhesion.

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Document Details

Document Type
Technical Report
Publication Date
Nov 10, 1987
Accession Number
ADA187930

Entities

People

  • M. Grunze
  • R. N. Lamb

Organizations

  • University of Maine

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Chemical Analysis
  • Chemical Properties
  • Chemistry
  • Desorption
  • Dissociation
  • Films
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Military Research
  • Photoelectrons
  • Polymers
  • Spectra
  • Thick Films
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene