Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An IR&D Report.
Abstract
A comprehensive study of advanced packaging methods for VLSI and VHSIC applications has been performed. Particular emphasis has been placed on the analytical tools necessary for the modeling and performance simulation (electrical, thermal and mechanical) of complex high performance microelectronic packaging structures. The models have been validated by extensive experimental testing. Packaging and board level performance has been evaluated for various digital logical families including. TTL, ECL and HCMOS. Design guidelines have been developed that can be used by circuit engineers to extract the maximum performance from the devices on various board techniques including multilayer ceramic and organic printed wiring boards. Both surface mounting and through hole mounting have been considered, including methods for designing optimum soldered interconnects for each operational scenario.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1987
- Accession Number
- ADA189666
Entities
People
- G. V. Clatterbaugh
- H. K. Charles Jr
Organizations
- Johns Hopkins University