Vapor Phase Deposition and Growth of Polyimide Films on Copper.

Abstract

The formation of thin polymide films from vapor phase deposited 4,4 Oxydianiline (ODA) and Pyromellitic dianhydride (PMDA) was studied by X-ray photoelectron spectroscopy and vibrational spectroscopies. Codeposition of ODA and PMDA onto polycrystalline copper substrates at room temperature, followed by heating in vacuum, led to polymerization and the formation of thermally stable polymide films. Films with thickness ranging from ultra-thin (12-30 A ) to several hundred nanometers thick were prepared by this method. Adhesion of the polymer to the surface involve chemical bonding to fragments of PMDA and ODA initially chemisorbed on the clean metal surface. Keywords: Dielectric films.

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Document Details

Document Type
Technical Report
Publication Date
Nov 10, 1987
Accession Number
ADA189969

Entities

People

  • C. W. Kong
  • J. P. Baxter
  • M. Grunze
  • R. N. Lamb
  • W. N. Unertl

Organizations

  • University of Maine

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Chemical Reactions
  • Chemistry
  • Coatings
  • Films
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Molecules
  • Phase
  • Polymeric Films
  • Polymers
  • Spectroscopy
  • Spin Coatings
  • Vapor Deposition
  • Vapor Phases

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene