Low Cost Electromagnetic Shielding Using Drywall Composites: Results of RFI (Radio-Frequency Interference) Testing of a Shielding Effectiveness.

Abstract

Because of developments in electronics technology, the need for electromagnetic shielding has increased. To reduce the cost of this shielding, new materials are needed. The U.S. Army Corps of Engineers, Fort Worth District (FWD), and the U.S. Army Construction Engineering Research Laboratory (USA-CERL) have developed composite materials which use standard, construction grade, aluminum foil-backed gypsum board in combination with either a metal mesh or lead foil. Special seams for these composites have been designed by U.S. Gypsum Company. USA-CERL evaluated the adequacy of each material and seam design by using radio frequency antennas and receivers to measure its shielding effectiveness when mounted in the wall of a shielded room. These evaluations showed that the composite panels met the specified requirement of 60 decibels (dB) of shielding. The composites were also shown to be adequate for most communications security applications. However, the addition of a seam decreased shielding by as much as 10 dB.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1987
Accession Number
ADA190374

Entities

People

  • Kevin K. Heyen
  • Peter F. Williams
  • Ray G. Mccormack

Organizations

  • Construction Engineering Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Army Corps Of Engineers
  • Composite Materials
  • Construction
  • Dynamic Range
  • Electromagnetic Interference
  • Electromagnetic Radiation
  • Electromagnetic Shielding
  • Electronics
  • Engineering
  • Frequency
  • Interference Analyzers
  • Monopole Antennas
  • Radio Frequency
  • Radio Frequency Interference
  • Signal Generators
  • Test And Evaluation
  • Test Equipment

Readers

  • Nuclear and Radiation Engineering.
  • Radar Systems Engineering.
  • Software Engineering

Technology Areas

  • Microelectronics