Correlation between Dielectric and Structural Properties during Epoxy Cure.

Abstract

The relationship between the dielectric properties and the molecular structure of a commercial epoxy resin, Ciba-Geigy's MY720, is reported. The ionic conductivity sigma was measured at several temperatures by microdielectrometry and correlated with the structural parameter, the glass transition temperature Tg, through a modified Williams Landel Ferry formulation where C1 is a constant and C2 and log sigma(Tg) are assumed to be a linear functions of Tg. Keywords: Conductivity, Thermosetting polymers, Williams Landel Ferry equation, Glass transition temperature, Epoxy resins, Amine hardener, Network structure, Microdielectrometry, Differential scanning calorimetry, Loss factor.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1987
Accession Number
ADA190696

Entities

People

  • Stephen D. Senturia
  • Sue A. Bidstrup
  • Wayne W. Bidstrup

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • C4I

DTIC Thesaurus Topics

  • Chemical Reactions
  • Computer Science
  • Conductivity
  • Curing
  • Curing Agents
  • Dielectric Properties
  • Electrical Engineering
  • Engineering
  • Epoxy Resins
  • Equations
  • Glass Transition Temperature
  • Materials
  • Materials Science
  • Polymers
  • Resins
  • Semiconductors
  • Transition Temperature

Readers

  • Polymer Science and Engineering.
  • Regression Analysis.