Hybrid PV HgCdTe IR Detectors Technology Reliability & Failure Physics Program: Environmental Stress Testing Plan.
Abstract
The objective of this test plan is to identify failure mechanisms in hybridized (indium bump interconnected) HgCdTe/Si focal plane arrays created by hybridization and environmental stress. Hybridization and environmental stresses identified in the statement of work to be addressed are; 1. Repetitive temperature cycling between 300K and 80K, 2. Dewar bakeout, 3. Dormant storage for several weeks at 130F, 4. Long term storage (Honeywell believes the contract is not long enough to address long term storage), and 5. Hybridization force (dislocation density versus RoA). In plan both test arrays and focal planes will be stressed and characterized. Focal planes will be used to evaluate imaging performance while test arrays (interconnected to Si leadout boards) will be used to analyze changes in device performance by allowing the current voltage characteristics of individual photodiodes to be analyzed. In the test of this plan the word characterize is used. After a test array has received a series of stresses, elements will be analyzed to identify the mechanism of failure. For example, if a test array has a large loss of interconnect it might be destructively pulled apart and analyzed using an SEM to determine where the loss of interconnect is occuring.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 27, 1987
- Accession Number
- ADA191165
Entities
Organizations
- Honeywell International, Inc.