Single Phase Liquid Immersion Cooling of Discrete Heat Sources in a Vertical Channel.

Abstract

Natural convection liquid cooling of simulated electronic components was investigated. A single column of eight protruding components was constructed using foil heaters mounted on the back of stainless steel rectangular blocks. These components were attached to a vertical plexiglass wall to simulate a column of 20 pin DIP's. A channel was formed by placing a smooth movable shrouding wall parallel to the test surface. The test surface and the shrouding wall were placed in a water immersion bath. Flow visualization was accomplished using a laser generated plane of light to illuminate suspended particles. Photographs were taken of the flow at the test surface mid-plane for four different power settings at each of three different channel widths. A nondimensional temperature and a modified Grashof number for each heated protrusion at each input power setting and channel width were determined. Keywords: Immersion cooling; Protruding heat sources; Vertical channels; Flow visualization.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1987
Accession Number
ADA191224

Entities

People

  • Sherrill J. Hazard Iii

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundary Layer
  • Circuit Boards
  • Computer Programs
  • Computers
  • Convection
  • Electronic Components
  • Electronic Equipment
  • Engineering
  • Flow Visualization
  • Heat Transfer
  • Heat Transfer Coefficients
  • Materials
  • Measurement
  • Mechanical Engineering
  • Photographs
  • Thermal Conductivity
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Fluid Dynamics.
  • Structural Dynamics.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Directed Energy
  • Microelectronics