The Inspection of Electronic Metallurgical Bonds.
Abstract
The solder bonds in electronic assemblies are an area of increased Non-Destructive Evaluation interest as the number of bonds per assembly increases, the size of the bonds decreases, and the dependence on the bonds for electrical and mechanical performance increases. The current inspection techniques are not detecting many defects, and the inspection techniques are not adequate for the near-term Surface Mount Technology improvements. Computed Tomography is a new NDE technology that is beginning to find its place in industry. This project has surveyed the field of printed circuit board manufacturing to determine the types of flaws that need to be detected to improve the reliability of solder bonds in electronic systems.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1988
- Accession Number
- ADA192197
Entities
People
- Bart Jackson
- James Stanley
- Jerel Smith