FEB (Multifilter Electronics Box) Lifting Device Analysis, Revision A,

Abstract

This document is to determine the mechanical loads produced when the FEB is either lifted manually with handles or by a sling and overhead hoist. 2. Relevant Documents 2.1 JA418 2.2 ES-MAS-DS-003 MAS Ground Support Equipment Specification 2.3 An Introduction to the Design and Behavior of Bolted Joints John H. Bickford, MARCEL DEKKER, New York 3. Lifting Apparatus 3.1 For the lifting of FEB by either handles or a sling from an overhead hoist, four eyebolts are attached to the top mounting edge, through the top cover and into the top flange of the sidewalls. When the FEB is to be lifted manually without mechanical assistance, two long stainless steel rods are inserted lengthwise through the upright eyebolts. A small collar is then slipped over the rod so that the rod cannot shift lengthwise. The rod ends which extend beyond the eyebolt positions serve as handles for two people to lift the FEB. When an overhead hoist is to be used, the rods are not used. Instead a wire-rope sling is attached to each eyebolt. The four sling arms meet at a center jump ring which is lifted by the hook of the overhead crane. A spreader frame is used just above the eye-bolt attachments so that the load transfered to the bolts is strictly vertical.

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Document Details

Document Type
Technical Report
Publication Date
Feb 10, 1988
Accession Number
ADA192313

Entities

People

  • Charles L. Croskey

Organizations

  • Pennsylvania State University

Tags

Communities of Interest

  • C4I

DTIC Thesaurus Topics

  • Bolted Joints
  • Bolts
  • Diameters
  • Elastic Properties
  • Elements
  • Finite Element Analysis
  • Ground Support
  • Ground Support Equipment
  • Margin Of Safety
  • Mechanical Properties
  • Modulus Of Elasticity
  • Shear Modulus
  • Shear Strength
  • Shear Stresses
  • Stainless Steel
  • Stresses
  • Tensile Strength

Readers

  • Clinical Trial Research.
  • Hydraulic Engineering.
  • Logistics and Supply Chain Management.

Technology Areas

  • Microelectronics