Natural Convection Immersion Cooling of an Array of Simulated Chips in an Enclosure Filled with Dielectric Liquid.

Abstract

An experimental natural convection heat transfer study of a simulated electronic circuit board has been conducted. The board has an array of 9 simulated chips, each dissipating up to 2.5 Watts. The board is immersed in FC75, a fluorocarbon liquid, in an enclosure whose top and bottom surfaces are constant temperature heat sinks. The experimental data have been expressed in terms of relevant dimensionless heat transfer parameters such as Nusselt and Rayleigh numbers. The trend is that, the chips located higher in the enclosure have lower heat transfer rates. Otherwise the chips in the same row behave in a similar way which implies a quasi-two dimensionality. Keywords: Electronic cooling.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1987
Accession Number
ADA193594

Entities

People

  • Turgay Pamuk

Organizations

  • Naval Postgraduate School

Tags

DTIC Thesaurus Topics

  • Boundary Layer
  • Circuit Boards
  • Circuits
  • Convection
  • Data Acquisition
  • Electronic Circuits
  • Electronic Components
  • Electronic Equipment
  • Energy
  • Energy Transfer
  • Engineering
  • Fluid Flow
  • Heat Transfer
  • Heat Transfer Coefficients
  • Integrated Circuits
  • Mechanical Engineering
  • Thermal Conductivity

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems