Reliability Assessment of Surface Mount Technology (SMT).
Abstract
This report documents an in-house study that was conducted in order to assess the current reliability problems associated with surface mount technology (SMT). Specific areas investigated included failure modes, design guidelines, reliability prediction techniques and reliability evaluation test methods associated with SMT. A Literature search was conducted and many IR&D programs were reviewed. The results showed a considerable amount of research in the area of SMT failure modes and in the development of SMT design guidelines. The two areas that were deficient were the development of a reliability prediction technique for SMT and the appropriateness of current reliability evaluation test methods. Keywords: Leadless chip carriers; Finite element analysis; Surface mount devices; Solder.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1988
- Accession Number
- ADA193759
Entities
People
- Gretchen A. Bivens
Organizations
- Rome Laboratory