Stress Related Failures Causing Open Metallization.

Abstract

Non-linear Finite Element Analysis has been used to model stresses and infer stress induced void formation in narrow Al-S; metal lines. Observed failures correlate well with calculated stresses determined by varying intrinsic stress of the passivation, topography, line width and silicon nodule size. Keywords: Aluminum, Sulfur, Modeling, Stress, Finite element analysis, Thin films, Voids, Conductors.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1988
Accession Number
ADA195061

Entities

People

  • Steven K. Groothuis

Organizations

  • Texas Instruments

Tags

DTIC Thesaurus Topics

  • Ceramic Materials
  • Creep
  • Elastic Properties
  • Fabrication
  • Failure Mode And Effect Analysis
  • Finite Element Analysis
  • Geometry
  • Integrated Circuits
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Semiconductor Manufacturing
  • Stress Strain Relations
  • Stresses
  • Thin Films
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Thin Film Deposition Science.

Technology Areas

  • AI & ML
  • AI & ML - Bayesian Inference