Report on an Overseas Visit to USA Relating to the Thermoelastic Measurement of Stresses, 16-21 August 1987.

Abstract

This report describes a short overseas visit made by the author to the United States in 1987. The purpose of the visit was to attend the 31st Annual International Technical Symposium on Optical and Optoelectronic Applied Science and Engineering, and to present an invited paper. Keywords: Thermoelasticity, Stress analysis, Nondestructive tests, Spate, Strain measurement.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1988
Accession Number
ADA195313

Entities

People

  • A. K. Wong

Tags

Communities of Interest

  • Air Platforms
  • Biomedical

DTIC Thesaurus Topics

  • Aluminum Alloys
  • Climate Change
  • Composite Materials
  • Department Of Defense
  • Detectors
  • Engineering
  • Frequency
  • Infrared Detection
  • Load Cells
  • Materials
  • Measurement
  • Mechanics
  • Residual Stress
  • Residuals
  • Stress Analysis
  • Stresses
  • Waveforms

Readers

  • Personnel Management and Statistics in the Military and Department of Defense
  • Structural Health Monitoring of Composite Structures.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics