Optimizing Focal Plane Interconnections.

Abstract

The interconnection of various elements in LWIR Focal Plane Arrays and associated signal processing electronics is currently more of a cut and try process than a straightforward design utilizing established performance parameters. Definition of this critical interface between detector and amplifier is hampered by the lack of baseline parameters relevant to the cryogenic environment and signal bandwidth of strategic defense systems. The specific objective of the Phase 1 contract is to define, through an industry survey, sufficient parameters to enable a Phase 2 effort to design, fabricate, and test a baseline generic focal plane interconnection cable. The results of the survey confirmed that there is a significant need for the proposed design guidelines. These same results also indicate, however, that the scope of the necessary effort to fabricate and test a meaningful baseline interconnection cable is beyond the time and budgetary limitations of an SBIR Program Phase 2 contract. Keywords: Far Infrared Radiation; Focal Plane Arrays; Infrared Detection. (jhd)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1987
Accession Number
ADA195552

Entities

People

  • Robert E. Howe

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Human Systems

DTIC Thesaurus Topics

  • Adhesives
  • Arrays
  • Capacitance
  • Contracts
  • Detectors
  • Electrical Conductivity
  • Electrical Properties
  • Flexible Electronics
  • Focal Plane Arrays
  • Focal Planes
  • Geometry
  • Impedance
  • Manufacturing
  • Materials
  • Signal Processing
  • Temperature Gradients
  • Thermal Conductivity

Readers

  • Image Processing and Computer Vision.
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics