Laser-Activated Metal Deposition.

Abstract

A process to selectively deposit copper on polyimide was developed. Laser irradiation of organometallic palladium compounds with a CW argon ion laser at 351 nm was used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution resulted in selective copper deposition. Since only a few monolayers of palladium were needed to catalyze the electroless copper process, fast writing speeds of up to 10 cm/s were achieved. Copper lines with 1.5 micro thickness and resistive of 3 mohm-cm were produced by this technique. (MJM)

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Document Details

Document Type
Technical Report
Publication Date
Jan 31, 1988
Accession Number
ADA195796

Entities

People

  • H. S. Cole
  • J. W. Rose
  • L. M. Levinson
  • R. Guida
  • Y. S. Liu

Organizations

  • General Electric

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Argon Lasers
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Ion Lasers
  • Laser Applications
  • Laser Beams
  • Lasers
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Military Research
  • Optical Properties
  • Quantum Yields
  • Three Dimensional

Readers

  • Pulsed Power and Plasma Physics.
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy
  • Directed Energy - Lasers
  • Directed Energy - Pulsed-Laser Deposition