Total Dose Response ofSilicon-on-Insulator (SOI) Metal-Oxide- Semiconductor Field-Effect Transistor's (MOSFET's)

Abstract

Total dose response of both NMOS and PMOS FET's fabricated on SIMOX and ZMR substrates was studied. Two types of back channel leakage currents were identified for the SIMOX devices. A back channel leakage due to MOSFET action uses the substrate bias as the gate bias. The other component is due to soft reverse characteristics of the body-drain junction. The back channel leakage due to MOSFET action varies with the substrate bias and thus varies with irradiation due to threshold voltage shift. The soft reverse current is a function of drain-body voltage and hence varies with substrate bias and irradiation. The threshold voltage, I-V characteristics, and subthreshold currents of both front and back channels as a function of total dose were obtained. Theses.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1988
Accession Number
ADA197216

Entities

People

  • Mark C. Biwer

Organizations

  • Air Force Institute of Technology

Tags

DTIC Thesaurus Topics

  • Bipolar Junction Transistors
  • Charged Particles
  • Crystal Structure
  • Electronics Laboratories
  • Equations
  • Implantation
  • Ion Implantation
  • Ionization
  • Ionizing Radiation
  • Materials
  • Metal Oxide Semiconductors
  • Metal Oxides
  • Modules (Electronics)
  • Power Electronics
  • Semiconductors
  • Test Facilities
  • X Rays

Readers

  • Nuclear and Radiation Engineering.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics