Digital Image Analysis System for Monitoring Crack Growth at Elevated Temperature

Abstract

The objective of the research work reported here was to develop a new concept, based on Digital Image Analysis, for monitoring the crack-tip position at elevated temperatures. The proposed system includes: a) Charge Coupled Device camera observing the crack-tip. b) PC-based frame grabber, capturing a 512 x 512 pixel frame. c) Digital Image Analysis software developed to locate and digitize the position of the crack-tip, on the observed image area. d) Step-motor driven stage, permitting the image-transmitting penetrator to follow-up the tip as it advances. e) A penetrator (fiber-optic or lenses) transmitting the magnified image from the vicinity of the crack-tip to the camera. The system was designed, assembled, and tested. Also, a program was developed for digitizing the crack- tip position. To evaluate the feasibility of the concept, its potential accuracy, resolution, temperature limitation and usefulness the system was tested at room and elevated temperature. The results of the testing and evaluation prove that the proposed concept is feasible, practical, and capable of performing at temperatures exceeding our initial objectives.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1988
Accession Number
ADA198649

Entities

People

  • Alex S. Redner
  • Arkady S. Voloshin

Tags

Communities of Interest

  • Engineered Resilient Systems

DTIC Thesaurus Topics

  • Accuracy
  • Acquisition
  • Brushless Dc Motors
  • Charge Coupled Devices
  • Computer Programming
  • Computers
  • Control Systems
  • Data Acquisition
  • Digital Images
  • Governments
  • High Temperature
  • Image Processing
  • Mechanics
  • Optical Materials
  • Security
  • Software Development
  • Test And Evaluation

Fields of Study

  • Physics

Readers

  • Image Processing and Computer Vision.
  • Materials Science (Mechanical Engineering).
  • Systems Analysis and Design