Vision Technology for Automated Inspection of Hybrid Microelectronics Assemblies

Abstract

The purpose of this review is to determine what is currently considered state-of-the-art for visually inspecting hybrid microelectronic circuits during assembly, with particular emphasis on the use of automation. In order to understand the feasibility and extent to which automated inspection equipment could be implemented, consideration has been given to the following: (1) the hybrid circuit industry in terms of its structure and market significance, (2) the process stages where visual inspection is needed, and (3) the various forms of visual inspection in use and development, including optical microscopy, 2-D, and 3-D machine vision. Keywords: Machine vision, Electronics, Microelectronics, Hybrid circuits, Inspection, Automation.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1988
Accession Number
ADA198790

Entities

People

  • Therese M. Philippi

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Artificial Intelligence
  • Character Recognition
  • Computer Vision
  • Computers
  • Detection
  • Detectors
  • Electronic Circuits
  • Electronic Components
  • Feature Extraction
  • Gray Scale
  • Image Processing
  • Light Sources
  • Manufacturing
  • Optics
  • Pattern Recognition
  • Robots
  • Signal Processing

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Facility/Structural Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics