Gas Jet Deposition of Multicomponent Ultrafine Microstructures

Abstract

The potential technological importance of multicomponent ultrafine microstructures makes it essential to develop methods of formation which permit both higher growth rates and improved control over material properties. During the course of our Phase I research effort, we have shown that our new proprietary technique, Gas Jet Deposition , has these capabilities and other advantages over established methods. In this technique, depositing atoms, molecules or clusters are seeded into a free jet which is directed at a substrate at low temperature in a high background pressure. The deposition rates can be exceptionally large; the high pressure, low temperature conditions permit the processing of new types of surfaces; and deposition can occur in a reactive mode for production of oxide and nitride materials. Phase I achievements include: (1) fabrication of uniform 100 layer alternating gold/copper thin film multilayer microstructures with 5 nm individual layer thickness; (2) fabrication of 3 nm gold particles; (3) deposition of copper oxide, gold oxide, silicon oxide and silicon nitride thin films. These results were confirmed using stylus profilometry, low angle x-ray diffraction, auger depth profiling, and transmission electron microscopy.

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Document Details

Document Type
Technical Report
Publication Date
Jun 28, 1988
Accession Number
ADA200101

Entities

People

  • Bret L. Halpern
  • Jerome J. Schmitt

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Auger Electron Spectroscopy
  • Auger Electrons
  • Electron Microscopy
  • Electron Spectroscopy
  • Electrons
  • Fabrication
  • Films
  • Materials Processing
  • Mechanical Properties
  • Nanoparticles
  • Oxide Films
  • Particle Size
  • Particles
  • Scattering
  • Spectra
  • Thin Films
  • X Rays

Fields of Study

  • Materials science

Readers

  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene