A Study of Natural Convection Cooling of Multiple Discrete Heat Sources in a Vertical Channel

Abstract

Natural convection liquid cooling of simulated electronic components in a vertical channel was investigated. The test surface contained a single column of eight rectangular, protruding heated elements, each simulating a 20 pin dual-in-line package. Temperature measurements and flow visualization were performed for a number of power dissipation levels and channel widths. Collectively, this information was used in interpreting the flow and transport characteristics. A correlation to predict the heat transfer rates was developed based on the component surface temperatures. Optimum channel widths were determined from these surface temperature measurements for the range of power levels investigated. Temperature distributions in the fluid were measured using a traversing thermocouple probe. Keywords include: Natural convection; Immersion cooling; Protruding heat sources; Vertical channel; and Flow visualization, Theses.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1988
Accession Number
ADA200947

Entities

People

  • Thomas D. Willson

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Boundary Layer
  • Circuit Boards
  • Convection
  • Electronic Components
  • Electronic Equipment
  • Engineering
  • Flow
  • Flow Visualization
  • Fluid Flow
  • Heat Transfer
  • Heat Transfer Coefficients
  • Measurement
  • Mechanical Engineering
  • Power Levels
  • Steady State
  • Surface Temperature
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Fluid Mechanics and Fluid Dynamics.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics