Prediction of Solder Joint Fatigue Life

Abstract

This study details the procedures used to predict the solder joint life from calculations of the joint strains and low-cycle fatigue data. The fatigue life of chip carrier/printed wiring board joints are predicted and compared to measured values. This prediction utilizes a finite element analysis of the strain distributions in a typical joint acted upon by an imposed displacement. These strains are then used to determine the fatigue life through low-cycle fatigue data. The correlation with joint behavior requires a size effect correction to the low-cycle fatigue lives. This correction is required because typical joint dimensions are smaller than the dimensions of the specimen utilized in the fatigue tests and the fatigue life depends upon the joint size. Keywords: Thermal fatigue.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1988
Accession Number
ADA204335

Entities

People

  • D. G. Thompson
  • H. D. Solomon
  • V. Brzozowski

Organizations

  • Martin Marietta

Tags

Communities of Interest

  • Advanced Electronics
  • Human Systems
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Classification
  • Climate Change
  • Contracts
  • Elastic Properties
  • Fatigue Life
  • Fatigue Tests (Mechanics)
  • Geometry
  • Materials
  • Materials Laboratories
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Modulus Of Elasticity
  • Plastic Properties
  • Stresses
  • Thermal Fatigue

Readers

  • Electrical Engineering
  • Joint Military Operations and Doctrine.
  • Materials Science (Mechanical Engineering).