Influence of Temperature on the Low Cycle Fatigue of Surface Mounted Chip Carrier/Printed Wiring Board Joints

Abstract

This is a study of the Low Cycle Fatigue of Chip Carrier/Printed Wiring Board joints tested at -55 C and +125 C. It differs from a previous study where the joints were tested at 35 C. The hysteresis loops were distorted. The slopes of the displacement vs. fatigue life curves were slightly lower and the fatigue lives were longer. These differences were especially significant when the change in joint resistance was used to define failure.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1987
Accession Number
ADA204336

Entities

People

  • H. D. Solomon

Organizations

  • Martin Marietta

Tags

DTIC Thesaurus Topics

  • Aeronautical Laboratories
  • Air Force
  • Analog Computers
  • Availability
  • Classification
  • Computers
  • Cracks
  • Displacement
  • Fatigue Cracking
  • Fatigue Life
  • Hysteresis
  • Low Temperature
  • Materials
  • Materials Laboratories
  • Measurement
  • Resistance
  • Security

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Forest Ecology
  • Structural Health Monitoring of Composite Structures.