Characterization of the Mechanisms Producing Bending Moments in Polysilicon Micro-Cantilever Beams by Interferometric Deflection Measurements

Abstract

Polysilicon micro cantilever beams and doubly supported beams are fabricated and conditioned with phosphorus doping and high temperature anneal cycles to assess the effects of process history and geometry on polysilicon microstructure rigidity. Using a Linnik interferometer, deflection trends for series of beams are measured and compared for several process conditions. Two bending moments can induce beam deflection: the first due to the beam boundary support, and the second, due to stress nonuniformity through the beam thickness. A comparison of polysilicon microstructure deflection behavior for doping and annealing conditions is presented and discussed.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1988
Accession Number
ADA204400

Entities

People

  • Jiahua Huang
  • Martin A. Schmidt
  • Stephen D. Senturia
  • Theresa A. Lober

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Bending Moments
  • Boundaries
  • Cantilever Beams
  • Computer Science
  • Electrical Engineering
  • Engineering
  • Fabrication
  • Films
  • Geometry
  • High Temperature
  • Measurement
  • Micro-Machines
  • Micromachining
  • Microstructure
  • Physical Properties
  • Surface Properties
  • Thickness

Fields of Study

  • Physics

Readers

  • Image Processing and Computer Vision.
  • Structural Dynamics.
  • Thin Film Deposition Science.