Effect of Physical Annealing on the Dynamic Mechanical Properties of A High T(g) Amine-Cured Epoxy Systems

Abstract

Physical annealing of a fully cured epoxy system has been investigated using the torsional braid analysis (TBA) technique. The dynamic mechanical properties were monitored during isothermal annealing at sub-Tg temperatures (-30 to 150 C). The properties after annealing were measured vs. temperature and compared with those of the unannealed state. Isothermally, the relative rigidity increased linearly with log time, whereas the logarithmic decrement decreased with time. Temperature-scanning the isothermally annealed material showed a maximum deviation from the unannealed material in the vicinity of the annealing temperature. Effects of sequential annealing at different isothermal temperatures suggested that annealing at different temperatures involves different scales of chain segment relaxation. Annealing, Physical aging, Vitrification, Glass transition, Kinetics, Torsional braid analysis, Epoxy, Dynamic mechanical analysis.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1989
Accession Number
ADA205980

Entities

People

  • G. Wisanrakkit
  • J. K. Gillham

Organizations

  • Princeton University

Tags

Communities of Interest

  • Air Platforms
  • Autonomy
  • Weapons Technologies

DTIC Thesaurus Topics

  • Chemical Engineering
  • Chemical Reactions
  • Chemistry
  • Engineering
  • Glass
  • Glass Transition Temperature
  • Heating
  • Low Temperature
  • Materials
  • Mechanical Properties
  • Military Research
  • Rigidity
  • Scanning
  • Specific Volume
  • Transition Temperature
  • Transitions
  • United States

Fields of Study

  • Materials science

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Polymer Science and Engineering.