Natural Convection Cooling of a 3 by 3 Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid: Effects of Boundary Conditions and Component Orientation.

Abstract

An experimental investigation of natural convection immersion cooling of two configurations of discrete heat sources in an enclosure filled with Fluorinert FC-75 has been conducted. A three by three array of rectangular protrusions was employed. In the first study, using the same equipment set-up of Benedict, the influence of changing the enclosure bottom surface boundary condition of flow patterns and heat transfer characteristics was examined. Both insulated and uniform temperature boundary conditions were considered. In the second set of experiments, a new chamber with the protrusions oriented vertically was assembled and effects of component orientation on the heat transfer characteristics were examined. In addition, timewise variations of temperature in several locations were measured an interpreted a different power levels. Theses. Keywords: Direct Immersion, Natural Convection Cooling, Dielectric Liquid Protrusions, Enclosure, Simulated Circuit Board, Strip Heaters, Flow Visualization, Convective Heat Transfer. (MJM)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1988
Accession Number
ADA206474

Entities

People

  • Edgardo I. Torres

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Acquisition
  • Buoyancy
  • Circuit Boards
  • Convection
  • Data Acquisition
  • Electronic Equipment
  • Elements
  • Flow Visualization
  • Heat Exchangers
  • Heat Transfer
  • Heat Transfer Coefficients
  • Measurement
  • Prandtl Number
  • Resistance
  • Surface Temperature
  • Thermal Conductivity
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Electrical Engineering
  • Electromagnetic Wave Scattering and Antenna Radiation Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems