Characterization and Cure Monitoring of Structural Adhesives
Abstract
Two potential replacement adhesives for a discontinued commercial adhesive were investigated. The composition and curing behavior of the replacements were compared to the commercial system utilizing a number of analytical techniques. High performance liquid chromatography, size exclusion chromatography, and thermogravimetric analysis were applied to establish the lot-to-lot consistency of the adhesive component composition. The thermal, dynamic mechanical, rheological, and dielectric properties, as a function of cure, were monitored by differential scanning calorimetry, torsional braid analysis, parallel plate rheometry, and microdielectrometry, respectively. Correlations between the various techniques and the state of cure of the adhesive were made. The glass transition temperature of the adhesive was observed to be a very sensitive measure of the state of cure. Keywords: Adhesives, Characterization, Curing, Analytical techniques, Thermal analysis.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1989
- Accession Number
- ADA206611
Entities
People
- David A. Dunn
- Howard H. Wong
- Stanley E. Wentworth
- Walter X. Zukas