High Quality Adhesive Analysis

Abstract

The purpose of this in-house project was to characterize organic adhesives used or being considered for use in microelectronic packages and assess their impact on reliability. Based on the results of adhesive characterization, a specification would be generated defining the critical properties required of these adhesives. A minimal amount of in-house adhesive evaluation was conducted due to problems in acquiring adhesives and procuring an ultra-low temperature freezer for storage of these shelf-life limited materials. With much industry input and support, the adhesive document was released as a MIL-STD-883 test method and not as a separate specification as earlier anticipated. Funding for the project was cancelled and the project was terminated. Adhesives, Adsorption, Chemical compounds, Moisture, Residuals, Solid state device reliability.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1989
Accession Number
ADA206920

Entities

People

  • Luke A. Lorang

Organizations

  • Rome Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Chemical Compounds
  • Failure Mode And Effect Analysis
  • Infrared Spectra
  • Low Temperature
  • Materials
  • Microcircuits
  • Moisture
  • Reliability
  • Shelf Life
  • Specifications
  • Standards
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Thermal Conductivity
  • Thermal Stability

Readers

  • Software Engineering
  • Surface Coatings Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics