Multicomponent E-Beam Resists Containing Organometallic Compounds and Reactive Monomers

Abstract

Negative working resists with combined e beam sensitivity and oxygen etch resistance have been formulated by combining a host polymer for dimensional stability during radiation processing, an unsaturated, non-volatile monomeric component for control of sensitivity, and, an organometallic compound to contribute RIE resistance in an oxygen plasma. We have incorporated these three components into blends by three methods. Microlithography, Electron beam resist, Organometallic compounds, Reactive ion etching.

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Document Details

Document Type
Technical Report
Publication Date
May 12, 1989
Accession Number
ADA207716

Entities

People

  • B. C. Dems
  • L. M. Vane
  • S. K. Obendorf
  • S. Malhotra
  • Y. M. Namaste

Organizations

  • Cornell University School of Chemical and Biomolecular Engineering

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Alkenes
  • Anhydrides
  • Chemical Synthesis
  • Chemistry
  • Classification
  • Electron Beams
  • Electrons
  • Engineering
  • Etching
  • Materials
  • Military Research
  • Organic Chemistry
  • Organometallic Compounds
  • Polymers
  • Radiation
  • Reactive Ion Etching
  • Resistance

Readers

  • Nanofabrication and Microfabrication.
  • Polymer Science and Technology

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene