Heat-Transfer and Friction Factor Design Data for All-Metal Compact Heat Exchangers

Abstract

This report covers analysis and testing Arthur D. Little, Inc conducted under Rotary Reciprocating Refrigerator Development Programs. To improve system life, an effort was undertaken to develop all-metal compact heat exchangers to replace existing heat exchangers which contain organic materials. Eliminating organic materials increases system life because outgassing organics can contaminate the helium working fluid and reduce system life. Perforated plate heat exchangers have been found to have inherently low axial conduction and are therefore excellent candidates for cryogenic applications where an all- metal design is required. A total of 11 plate cores were tested; 2 were chemically etched, 1 was mechanically punched, and 8 were manufactured using electron beam drilling. Hole size, percent open area, and plate thickness parameters were varied among the plates. Experimental results were compared to analytical projections and found to differ significantly. The single-blow transient test technique was used to determine the heat transfer coefficients and the isothermal pressure drop test was used to determine friction factors, as a function of Reynolds number.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1989
Accession Number
ADA208108

Entities

People

  • Christina L. Cain

Organizations

  • Wright Laboratory

Tags

Communities of Interest

  • Air Platforms
  • C4I
  • Sensors

DTIC Thesaurus Topics

  • Electron Beams
  • Equations
  • Fluid Flow
  • Geometry
  • Heat Exchangers
  • Heat Loss
  • Heat Transfer
  • Heat Transfer Coefficients
  • Heat Transmission
  • High Pressure
  • Orientation (Direction)
  • Plastic Explosives
  • Reynolds Number
  • Steady State
  • Test Methods
  • Thermal Conductivity
  • Thermodynamics

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Software Engineering

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems