Predicting Temperatures for IR Image Simulation Based on Solids Modeling

Abstract

FSTC attempts to provide signature data of existing and conjectured foreign vehicles. Usually details of these vehicles are not fully known, which presents a special problem in reporting their IR signatures. A method for predicting temperatures based on solids modeling has been developed at ERIM to easily create realistic, simulated IR imagery of complicated geometries. The technique presented in this report for predicting temperatures for IR image simulation is one step towards easily and accurately modeling IR signatures of foreign vehicles. The key technology development in the present system is the automatic creation of a thermal conduction model from a solid geometric model. Using the conduction model temperatures are predicted and IR images simulated. The report discusses the key techniques used in creating the thermal model. The present system is based on the U.S. Army's Ballistic Research Laboratory's solids modeling software (GIFT). Results are presented showing simulated IR images of complicated, realistic targets. The simulated target images show the effects of internal heating under simple environmental effects.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1988
Accession Number
ADA208532

Entities

People

  • Bruce E. Morey

Organizations

  • Environmental Research Institute of Michigan

Tags

Communities of Interest

  • Ground and Sea Platforms
  • Sensors

DTIC Thesaurus Topics

  • Computational Fluid Dynamics
  • Computational Science
  • Computer Graphics
  • Conduction (Heat Transfer)
  • Differential Equations
  • Engineering
  • Finite Element Analysis
  • Geometry
  • Ground Vehicles
  • Heat Transfer
  • Heat Transfer Coefficients
  • Image Processing
  • Lists (Data Structures)
  • Parallel Computing
  • Simulations
  • Surface Temperature
  • Trees (Data Structures)

Readers

  • Computational Modeling and Simulation
  • Computer Vision.
  • Thermal Physics or Thermal Science.