Industrial Technology Modernization. Pick and Place Assembly Machine. Project 1. Phase 2

Abstract

Both leaded and leadless surface-mount components will be automatically placed on Printed Wiring Boards (PWPs). A pattern recognition vision system will identify circuit board positions and feed offset information to the host microprocessor. A pick and place machine will be programmed to interface with microprocessor and individually mount prepared parts to the board surface. Automatic pick and place machinery, Automatic component mounting, Electronics.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1987
Accession Number
ADA209702

Entities

Organizations

  • General Dynamics

Tags

Communities of Interest

  • Advanced Electronics
  • Autonomy
  • Biomedical
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Accuracy
  • Assembly
  • Circuit Boards
  • Circuits
  • Computers
  • Contractors
  • Contracts
  • Corporations
  • Electronic Circuits
  • Electronics
  • Engineering
  • Fabrication
  • Manufacturing
  • Manufacturing Engineering
  • Pattern Recognition
  • Recognition
  • Standards

Readers

  • Computer Vision.
  • Electrical Engineering
  • Strategic Security Studies

Technology Areas

  • AI & ML
  • AI & ML - DoD AI Strategy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems