Nondestructive Evaluation of Metallized Tape Bonds Formed by Tape Automated Bonding (TAB)

Abstract

This contract was one of two awarded to develop a new test for the nondestructive evaluation of metallurgical tape bonds which interconnect a VLSI/ VHSIC chip to a microcircuit package or substrate. The process of forming the interconnections is known as Tape Automated bonding, or TAB. The accepted standard of nondestructive wire pull testing is difficult or impossible to apply to TAB furthermore, it may be subject to artifacts which cause severe interpretation problems. Experiments performed in this study demonstrated the utility of Scanning Laser Acoustic Microscopy (SLAM), in evaluating TAB bonds both at the site of the IC chip and at the site of the interconnection package and the results show excellent correlation to bond quality. Keywords: Tape automated bonding, Non-destructive evaluation of bonds; Very high speed integrated circuits (VHSIC), Very large scale integrated circuits, Tape wound construction.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1989
Accession Number
ADA209764

Entities

People

  • Frank J. Cichanski
  • Janet E. Semmens
  • Lawrence W. Kessler

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Engineered Resilient Systems
  • Sensors

DTIC Thesaurus Topics

  • Composite Materials
  • Data Processing
  • Detectors
  • Geometry
  • Gray Scale
  • Information Processing
  • Integrated Circuits
  • Materials Testing
  • Microscopy
  • Operating Systems
  • Optical Images
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Test Methods
  • Transducers
  • Wave Propagation

Fields of Study

  • Engineering

Readers

  • Computer Science.
  • Integrated Circuit Design and Technology.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene