An Experimental and Analytical Program to Develop Crack Tip Fracture Criteria

Abstract

The large plastic deformations at the tip of a crack in a ductile heat treatment of 4340 steel are studied numerically and experimentally. The numerical simulation of the experiment uses a small strain, incremental plasticity law, with a power law hardening behavior. Both the inplane and out- plane deformations are measured on the same speciment at the same time. The experimental technique of moire interferometry is used to measure the in-plane displacements. This technique is described in detail, including an analysis of the effort of out-of-plane rotations on the use of the technique. A three beam interferometer and a four beam interferometer are compared. The out-of-plane displacements are measured with a Twyman-Green interferometer. The analysis of this data is still underway and will be forward when completed. The numerical model is described in detail. The material properties are determined from a uniaxial test on specimens taken from the same bar as the fracture specimens and with identical heat treatment. A numerical model of the fracture specimen having 7581 degrees of freedom is used to provide data for comparison between 400 N (linear behavior) up to 75000 N (catastrophic failure of the steel specimen) in fourteen steps.

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Document Details

Document Type
Technical Report
Publication Date
Jul 19, 1989
Accession Number
ADA211565

Entities

People

  • C. R. Schultheisz
  • W. G. Knauss

Organizations

  • California Institute of Technology

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Cameras
  • Crack Tips
  • Digital Images
  • Heat Treatment
  • Image Processing
  • Images
  • Materials
  • Measurement
  • Mechanics
  • Modulus Of Elasticity
  • Operating Systems
  • Photographs
  • Plastic Deformation
  • Simulations
  • Standing Waves
  • Stress Strain Relations
  • Two Dimensional

Fields of Study

  • Physics

Readers

  • Computational Modeling and Simulation
  • Materials Science (Mechanical Engineering).
  • Optical Physics and Photonics.