Silicon Hybrid Wafer Scale Integration Interconnect Evaluation
Abstract
This thesis considered the electrical characteristics of interconnections that have been proposed for use in silicon hybrid wafer scale integration (WSI) approaches. The study was based on a set of five-inch test wafers, containing various interconnection structures previously designed at AFIT. Two test wafers used a special polyimide dielectric, while a third was composed of a benzocyclobutene (BCB). The investigated structures represented 10 cm length aluminum, coupled, stripline-like transmission lines. The metrics used included continuity measurements, ac measurement of the characteristic impedance and coupling levels, and pulsed-signal response measurements. Continuity results indicated transmission and leakage failures in all wafers, although the failure mechanisms were sometimes wafer-specific. The characteristic impedance measurement technique was flawed, but revealed interesting information concerning the driving-point impedances of the structures. Most coupled structures manifested coupling responses which were consistent in shape with theoretical estimates, but higher in magnitude by 10-20 dB. All structures revealed coupling levels lower than -25 dB. Despite correlation difficulties, the results implied that transmission line behavior is manifested in WSIC interconnections.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1989
- Accession Number
- ADA215353
Entities
People
- James C. Lyke
Organizations
- Air Force Institute of Technology