Computer Simulation of Electromigration in Thin Films

Abstract

Computational results of modelling electromigration in metal stripes without passivation but with reasonably realistic grain and grain-boundary configurations representing both unannealed and annealed strips have shown moderate reductions in a measure of damage by electromigration in the annealed case.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1989
Accession Number
ADA216382

Entities

People

  • H. B. Huntington
  • P. P. Meng
  • Y.-t. Shy

Organizations

  • Rensselaer Polytechnic Institute

Tags

Communities of Interest

  • C4I
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Annealing
  • Boundaries
  • Classification
  • Computer Simulations
  • Computers
  • Diffusion
  • Equations
  • Films
  • Grain Boundaries
  • Grain Size
  • Materials
  • Security
  • Simulations
  • Steady State
  • Surface Properties
  • Two Dimensional

Readers

  • Computational Modeling and Simulation
  • Manufacturing Engineering.
  • Semiconductor Device Technology