Encapsulation and Packaging of Integrated Circuits,

Abstract

Contents: Papers Submitted to Refereed Journals, Papers Published in Refereed Journals, Books Submitted for Publication, Books Published, Technical Reports Published, Patents Filed, Patents Granted, Invited Presentations at Topical or Scientific/Technical Society Conferences, Contributed Presentations at topical or Scientific/Technical Society Conferences, Honors/Awards/Prizes, Number of Graduate Students Receiving Full or Partial Support on ONR Grant or Contract (Total: 3, Minorities: 1, Asian: 1), Number of Postdoctoral Fellows Receiving Full or Partial Support on ONR Grant or Contract (Total: 1, Minorities: 1, Asian: 1), and Other Funding.

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Document Details

Document Type
Technical Report
Publication Date
May 05, 1990
Accession Number
ADA222169

Entities

People

  • David S. Soane

Organizations

  • University of California, Berkeley

Tags

DTIC Thesaurus Topics

  • Chemical Engineering
  • Chemistry
  • Composite Materials
  • Composite Structures
  • Dielectric Properties
  • Dielectrics
  • Encapsulation
  • Films
  • High Temperature
  • Integrated Circuits
  • Materials
  • Microelectronics
  • Polymeric Films
  • Polymers
  • Second Harmonic Generation
  • Thermosetting Plastics
  • Thin Films

Readers

  • Academic Conference Management
  • Research Science/Academic Research