Materials for High-Density Electronic Packaging and Interconnection

Abstract

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

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Document Details

Document Type
Technical Report
Publication Date
Apr 10, 1990
Accession Number
ADA222985

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Synthesis
  • Chemistry
  • Dielectrics
  • Electronics Industry
  • Electronics Laboratories
  • Manufacturing
  • Material Degradation Processes
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Working
  • Polymeric Films

Readers

  • Defense Acquisition Program Management
  • Military History of the United States in the 20th Century.
  • Software Engineering

Technology Areas

  • Microelectronics