Reliability Analysis/Assessment of Advanced Technologies
Abstract
This report has been prepared to summarize the technical study performed to determine the reliability characteristics of advanced technologies. The study covered existing reliability models and the development of new models. The devices that were investigated were: Very Large Integrated Circuits (VLSI), Memory Circuits, Hybrid Circuits, Microprocessors, and Gallium Arsenide Microwave Monolithic Integrated Circuits (GaAs MMIC). Packaging, environmental quality, and maturity were other factors that were considered in this investigation. The results of the study are: reliability models that extend the range of MIL-HDBK 217, end of life predication models for in-depth circuit and packaging design and new factors quality assessment. These data will be transitioned from the report to MIL-HDBK 217 for use by government and contractor personnel in estimating the reliability of new equipments. Keywords: Reliability, Computer hardware, Failure rate, VHSIC, GaAs, Hybrid, Gallium Arsenide, Microelectronics, Memory devices.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1990
- Accession Number
- ADA223647
Entities
People
- J. S. Rapa
- R. E. Twist
- R. H. Seidl
- T. A. Jennings
- W. J. Garry
Organizations
- Westinghouse Electric Corporation