Smart Microsensors for High Temperature Applications. Phase 1

Abstract

Microsensors find applications in many important areas of U.S. military hardware. Advances in aircraft and internal combustion engines are placing increasing demands on the electronics which play an increasingly important role in engine control. Complexity of control circuits has demanded increases in the scale of integration and in reliability, and have suggested the placement of high levels of functionality near the point of use. Engine performance must be evaluated with sensors and used intelligently to maintain optimum efficiency. Recent advances in microsensor technology have provided smaller, more economical sensors for these applications. With smaller sensors the need for signal conditioning electronics in close proximity to the sensor has become an increasingly important issue. The proposed three-phase project addresses the development of smart sensors for applications under high temperature ambients (up to 350 C). The approach proposed here is the demonstration of the usefulness of the SOI material obtained by the Isolated Silicon Epitaxy (ISE) process for high temperature sensor applications. This would couple with process development of sensor elements.

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Document Details

Document Type
Technical Report
Publication Date
Jun 28, 1990
Accession Number
ADA224151

Entities

People

  • Paul M. Zavracky

Organizations

  • Kopin Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Cantilever Beams
  • Classification
  • Combustion
  • Contracts
  • Corporations
  • Crystals
  • Demonstrations
  • Electronics
  • Etching
  • Fabrication
  • High Temperature
  • Materials
  • Mechanical Properties
  • Mechanical Structure
  • Microsensors
  • Military Research
  • Single Crystals

Readers

  • Sensor Fusion and Tracking Systems.
  • Software Engineering
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems