Dynamic Consolidation of Super Hard Materials

Abstract

Shock consolidation experiments were conducted via flyer impact on synthetic diamond (6-12 microns) and cubic boron nitride (c-BN) (4-8 microns) admixed with SiC whisker, Si3N4 whisker, SiC powder and Si powder contained in stainless steel capsules in the shock pressure range 10-30 GPa. Scanning electron microscopy and transmission electron microscopy imaging of the samples revealed no plastic deformation or melting of diamond and virtually no deformation of c-BN, whereas the SiC and Si3N4 whiskers were extensively melted and recrystallized into bundle-shaped crystallites. In contrast, SiC powder mixed with diamond was also melted but demonstrated equant grain growth. A new mixture model of powder plus whisker materials is formulated on the basis of sphere-rod mixing and packing experiments. The model assigns excess porosity to the zone around whiskers and yields a better description of the energy deposition mechanism of the consolidation of powder-whisker systems. Some of the experiments employed Sawaoka's post-shock annealing technique, in which the sample is sandwiched between two layers of a mixture of titanium powder plus carbon. Very well consolidated samples were obtained with post-shock heating under shock pressures of only about 12 GPa. (jes)

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Document Details

Document Type
Technical Report
Publication Date
Jun 25, 1990
Accession Number
ADA224460

Entities

People

  • G. Liu
  • G. M. Bond
  • Hua Tan
  • Thomas J. Ahrens
  • Wenbo Yang

Organizations

  • California Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Ceramic Materials
  • Contrast
  • Crystals
  • Electron Microscopy
  • Electrons
  • Energy
  • Grain Growth
  • Heat Energy
  • Heat Of Fusion
  • Materials
  • Melting Point
  • Microscopy
  • Scanning Electron Microscopy
  • Silicon Carbide
  • Stainless Steel
  • Thermodynamics
  • Transmission Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Combustion Dynamics and Shock Wave Physics.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene