Mechanical Properties of Microelectronics Thin Films: Silicon Nitride (Si3N4)

Abstract

Mechanical design of microfabricated devices requires knowledge of mechanical material properties. Thin film material properties are sensitively process dependent, and should therefore be organized accordingly. A relational database of material properties is under development as part of a general micro- electro-mechanical computer aided design environment. A computerized literature search through the published values for Silicon Nitride (Si3N4) properties under various processing conditions resulted in the following document. Keywords: Micromechanical analysis, Deformable structures.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1989
Accession Number
ADA225394

Entities

People

  • Fariborz Maseeh
  • Miles Arnone
  • Stephen D. Senturia

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bulk Materials
  • Ceramic Materials
  • Chemical Vapor Deposition
  • Computer Science
  • Computer-Aided Design
  • Films
  • Frequency
  • Gas Flow
  • Mass Spectrometry
  • Materials
  • Mechanical Properties
  • Modulus Of Elasticity
  • Refractive Index
  • Residual Stress
  • Thermal Expansion
  • Thin Films
  • Three Dimensional

Readers

  • Database Systems and Applications
  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems