Mechanical Properties of Microelectronics Thin Films: Silicon DiOxide (SiO2)

Abstract

Mechanical design of microfabricated devices requires knowledge of mechanical material properties. Thin film material properties are sensitively process dependent, and should therefore be organized accordingly. A relational database of material properties is under development as part of a general micro- electro-mechanical CAD environment. A computerized literature search through the published values for Silicon DiOxide (SiO2) properties under various processing conditions resulted in the following document.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1989
Accession Number
ADA225395

Entities

People

  • Fariborz Maseeh
  • Sean M. Gelston
  • Stephen D. Senturia

Organizations

  • Massachusetts Institute of Technology

Tags

DTIC Thesaurus Topics

  • Chemical Engineering
  • Chemical Vapor Deposition
  • Chemistry
  • Computer Science
  • Computer-Aided Design
  • High Pressure
  • Materials
  • Materials Engineering
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Oxide Films
  • Refractive Index
  • Silicon Dioxide
  • Thermal Expansion
  • Thin Films
  • Three Dimensional

Readers

  • Business Analytics
  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems