Vapor Deposition of Polyimide and Polyimide Precursors on Copper

Abstract

In this article we describe experiments in which ultra-thin films of polyimide were formed on polycrystalline and (111) single crystal copper substrates following heating of a vapor deposited layer of polyamic acid produced by codeposition of 4,4'-diaminodiphenyl ether (ODA) and 1,2,4,5- benzenetetracarboxylic dianhydride (PMDA). The adsorption of the pure components and their subsequent polymerization was followed, in situ, with X-ray photoelectron spectroscopy. Molecular adsorption of the monomers was studied to determine their thermal stability. The composition and adhesion of the thin polyimide film is influenced by fragmentation of precursors at the interface. Keywords: Adhesion, Vapor deposition, Polyimide films, X-ray photoelectron spectroscopy.

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Document Details

Document Type
Technical Report
Publication Date
Aug 15, 1990
Accession Number
ADA225729

Entities

People

  • C. W. Kong
  • J. Baxter
  • M. Grunze
  • R. N. Lamb
  • W. N. Unertl

Organizations

  • University of Maine

Tags

Communities of Interest

  • Advanced Electronics
  • C4I
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Chemistry
  • Dissociation
  • Films
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Military Research
  • Molecules
  • Photoelectrons
  • Polymeric Films
  • Spectra
  • Spectroscopy
  • Thick Films
  • Thin Films
  • Vapor Deposition
  • X Rays

Readers

  • Polymer Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene