Failure Analysis Techniques for the Evaluation of Electrical and Electronic Components in Aircraft Accident Investigations

Abstract

Failure analysis techniques for the evaluation of electrical and electronic components are summarized for: lamps, wiring, connectors, switches, magnetic materials, printed wiring boards and microelectronic devices. Techniques using optical and scanning electron microscopy (SEM) for the analysis of these components are described. Energy Dispersive X-ray analysis (EDAX) of elemental constituents, X-ray radiography, and specialized electrical measurements are also described. The potential for the techniques to distinguish pre-accident conditions from post-impact damage was assessed. Data on the failure rates of aircraft electrical components was reviewed. Data from the Air Force Mishap database indicates that 36 percent of electrical failures on aircraft are caused by interconnections: wiring and connectors. Corrosion is identified as a major cause of connector problems.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1990
Accession Number
ADA226381

Entities

People

  • David W. Mercaldi
  • Donald E. Allison
  • Donald Galler

Organizations

  • Exponent

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Failure Mode And Effect Analysis
  • Mass Spectrometry
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Sodium Compounds
  • Transducers

Readers

  • Software Engineering
  • Structural Health Monitoring of Composite Structures.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics