RAAM Integrated Circuit Source Change Analysis

Abstract

This report prepared to provide an analysis of the change from gold eutectic die attach integrated circuits (I.C.) to sliver-glass die attach I.C. for the M718/M741 remote antiarmor mine (RAAM). An overview of the contract history of the present RAAM electronic lens assembly (ELA) contractor, Accudyne Corporation of Janesville, WI, is presented. An outline of both the gold eutectic die attached process and the silver-glass die attach process is also given. The Government test plan for the die attach change was analyzed and the results and conclusions of the tests listed in the plan are provided. Keywords: Integrated circuits; Land mines; Antiarmor mines.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1990
Accession Number
ADA227325

Entities

People

  • John Printz

Organizations

  • United States Army Armament Research, Development and Engineering Center

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Artillery Ammunition
  • Circuits
  • Contractors
  • Contracts
  • Corporations
  • Electronic Circuits
  • Electronic Components
  • Engineering
  • Engineers
  • Failure Mode And Effect Analysis
  • Governments
  • Integrated Circuits
  • Materials
  • Scatterable Mines
  • Semiconductors
  • Test And Evaluation
  • Test Equipment

Readers

  • Electrochemical Surface Science
  • Integrated Circuit Design and Technology.
  • Logistics and Supply Chain Management.

Technology Areas

  • Microelectronics